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Texas Instruments CC2591RGVR

IC RF FRONT END 2.4GHZ 16QFN
part number has RoHS
Manufacturer # :CC2591RGVR
Manufacturer :Texas Instruments
Dasenic # :CC2591RGVR-DS
Customer # :
Description : IC RF FRONT END 2.4GHZ 16QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
65+$ 0.6975$ 45.34
140+$ 0.6525$ 91.35
215+$ 0.6300$ 135.45
310+$ 0.5850$ 181.35
400+$ 0.5625$ 225
In Stock: 47745
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6975
Total :$ 0.70
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CC2591RGVR information

  • Texas Instruments CC2591RGVR technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Front End (LNA + PA)
  • Product Status:Not For New Designs
  • Features:-
  • Package / Case:16-VQFN Exposed Pad
  • Frequency:2.4GHz
  • Supplier Device Package:16-VQFN (4x4)
  • R F Type:802.15.4, Zigbee®
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CC2591RGVR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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