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Texas Instruments CC2540F128RHAT
Manufacturer # :CC2540F128RHAT
Manufacturer :Texas Instruments
Dasenic # :CC2540F128RHAT-DS
Datasheet : CC2540F128RHAT Datasheet
Customer # :
Description : Bluetooth® Low Energy wireless MCU with USB
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In Stock: 1841
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.862
Total :$ 2.86
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CC2540F128RHAT information
Texas Instruments CC2540F128RHAT technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Active
- Package / Case:40-VFQFN Exposed Pad
- Frequency:2.4GHz
- Type:TxRx + MCU
- Sensitivity:-93dBm
- Protocol:Bluetooth v4.0
- Modulation:GFSK
- G P I O:21
- Operating Temperature:-40°C ~ 85°C
- Voltage- Supply:2V ~ 3.6V
- Memory Size:128kB Flash, 8kB SRAM
- Data Rate( Max):1Mbps
- Serial Interfaces:SPI, USART, USB
- R F Family/ Standard:Bluetooth
- Power- Output:4dBm
- Current- Receiving:19.6mA ~ 22.1mA
- Current- Transmitting:21.1mA ~ 31.6mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CC2540F128RHAT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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