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Texas Instruments CC2500RGP
Manufacturer # :CC2500RGP
Manufacturer :Texas Instruments
Dasenic # :CC2500RGP-DS
Datasheet : CC2500RGP Datasheet
Customer # :
Description : IC RF TXRX ISM>1GHZ 20VFQFN
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In Stock: 36000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.927
Total :$ 0.93
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CC2500RGP information
Texas Instruments CC2500RGP technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:20-VFQFN Exposed Pad
- Frequency:2.4GHz
- Type:TxRx Only
- Sensitivity:-104dBm
- Supplier Device Package:20-QFN (4x4)
- Data Rate ( Max):500kBaud
- Memory Size:-
- Voltage - Supply:1.8V ~ 3.6V
- Power - Output:1dBm
- Protocol:-
- Serial Interfaces:SPI
- R F Family/ Standard:General ISM > 1GHz
- Current - Receiving:13.3mA ~ 19.6mA
- Modulation:2FSK, GFSK, MSK, OOK
- G P I O:-
- Current - Transmitting:11.1mA ~ 21.5mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CC2500RGP provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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