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Texas Instruments CC2340R52E0RKPR
Manufacturer # :CC2340R52E0RKPR
Manufacturer :Texas Instruments
Dasenic # :CC2340R52E0RKPR-DS
Datasheet : CC2340R52E0RKPR Datasheet
Customer # :
Description : SimpleLink™ 32-bit Arm® Cortex®-M0+ Bluetooth® Low Energy wireless MCU with 512-kB flash
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In Stock: 14949
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.349
Total :$ 2.35
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Payment :
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CC2340R52E0RKPR information
Texas Instruments CC2340R52E0RKPR technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Active
- Package / Case:40-VFQFN Exposed Pad
- Frequency:2.36GHz ~ 2.5GHz
- Type:TxRx + MCU
- Sensitivity:-102dBm
- Protocol:Bluetooth v5.3, Wireless M-Bus, Zigbee®
- Modulation:DSSS, GFSK, QPSK
- G P I O:12
- Series:SimpleLink™
- Operating Temperature:-40°C ~ 125°C (TA)
- Voltage- Supply:1.71V ~ 3.8V
- Memory Size:512kB Flash, 12kB ROM, 36kB SRAM
- Data Rate( Max):3Mbps
- Serial Interfaces:GPIO, I²C, PWM, SPI, UART
- R F Family/ Standard:Bluetooth
- Power- Output:8dBm
- Current- Receiving:5.3mA ~ 9mA
- Current- Transmitting:4mA ~ 19mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CC2340R52E0RKPR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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