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  • Texas Instruments CC1310F64RGZT

    IC RF TXRX+MCU ISM<1GHZ 48VFQFN
  • part number has RoHS
  • Mfr.Part # :CC1310F64RGZT
  • Manufacturer :Texas Instruments
  • Dasenic # :CC1310F64RGZT-DS
  • Datasheet :pdf download CC1310F64RGZT Datasheet
  • Description : IC RF TXRX+MCU ISM<1GHZ 48VFQFN
  • Package :-
  • Quantity :
    Unit Price : $ 6.786Total : $ 6.79
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 4014
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 6.7860$ 6.79
10 +$ 6.0660$ 60.66
25 +$ 5.5260$ 138.15
100 +$ 4.8780$ 487.80
250 +$ 4.5270$ 1131.75

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Texas Instruments CC1310F64RGZT technical specifications, attributes, parameters.
Category:RF and Wireless/RF Transceiver ICs
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:48-VFQFN Exposed Pad
Frequency:300MHz ~ 930MHz
Type:TxRx + MCU
Sensitivity:-124dBm
Supplier Device Package:48-VQFN (7x7)
Data Rate ( Max):50kbps
Memory Size:64kB Flash, 16kB RAM
Voltage - Supply:1.8V ~ 3.8V
Power - Output:14dBm
Protocol:-
Serial Interfaces:I²C, I²S, JTAG, SPI, UART
R F Family/ Standard:General ISM < 1GHz
Current - Receiving:5.5mA
Modulation:DSSS, GFSK
G P I O:30
Current - Transmitting:12.9mA ~ 22.6mA
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
CC1310F64RGZT provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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