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  • Texas Instruments CC1100ERGPT

    Low-power Sub-1GHz wireless transceiver for China and Japan frequency bands
  • part number has RoHS
  • Mfr.Part # :CC1100ERGPT
  • Manufacturer :Texas Instruments
  • Dasenic # :CC1100ERGPT-DS
  • Datasheet :pdf download CC1100ERGPT Datasheet
  • Description : Low-power Sub-1GHz wireless transceiver for China and Japan frequency bands
  • Package :-
  • Quantity :
    Unit Price : $ 1.71Total : $ 1.71
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 28952
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 1.7100$ 1.71
25 +$ 1.6740$ 41.85
100 +$ 1.6110$ 161.10
500 +$ 1.5390$ 769.50
1000 +$ 1.4580$ 1458.00

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Texas Instruments CC1100ERGPT technical specifications, attributes, parameters.
Category:RF and Wireless/RF Transceiver ICs
Product Status:Active
Package / Case:20-VFQFN Exposed Pad
Frequency:470MHz ~ 510MHz, 950MHz ~ 960MHz
Type:TxRx Only
Sensitivity:-112dBm
Modulation:2FSK, ASK, GFSK, MSK, OOK
Operating Temperature:-40°C ~ 85°C
Voltage- Supply:1.8V ~ 3.6V
Data Rate( Max):500kBaud
Serial Interfaces:SPI
R F Family/ Standard:General ISM < 1GHz
Power- Output:10dBm
Current- Receiving:15.4mA ~ 20mA
Current- Transmitting:15.8mA ~ 30.9mA
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
CC1100ERGPT provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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