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Texas Instruments CC1010PAGG3
Manufacturer # :CC1010PAGG3
Manufacturer :Texas Instruments
Dasenic # :CC1010PAGG3-DS
Datasheet : CC1010PAGG3 Datasheet
Customer # :
Description : IC RF TXRX+MCU ISM<1GHZ 64TQFP
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In Stock: 69
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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CC1010PAGG3 information
Texas Instruments CC1010PAGG3 technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:64-TQFP
- Frequency:315MHz, 433MHz, 868MHz, 915MHz
- Type:TxRx + MCU
- Sensitivity:-107dBm
- Supplier Device Package:64-TQFP (10x10)
- Data Rate ( Max):76.8kBaud
- Memory Size:32kB Flash, 2kB SRAM
- Voltage - Supply:2.7V ~ 3.6V
- Power - Output:0dBm
- Protocol:-
- Serial Interfaces:SPI, UART
- R F Family/ Standard:General ISM < 1GHz
- Current - Receiving:9.1mA ~ 11.9mA
- Modulation:FSK
- G P I O:26
- Current - Transmitting:5.3mA ~ 26.6mA
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CC1010PAGG3 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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