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Texas Instruments BUF634FKTTTE3
Manufacturer # :BUF634FKTTTE3
Manufacturer :Texas Instruments
Dasenic # :BUF634FKTTTE3-DS
Datasheet : BUF634FKTTTE3 Datasheet
Customer # :
Description : IC BUFFER 1 CIRC DDPAK/TO263-5
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In Stock: 3732
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.2034
Total :$ 17.20
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BUF634FKTTTE3 information
Texas Instruments BUF634FKTTTE3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Not For New Designs
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:TO-263-6, D²Pak (5 Leads + Tab), TO-263BA
- Current - Supply:15mA
- Output Type:-
- Supplier Device Package:DDPAK/TO-263-5
- Number of Circuits:1
- Amplifier Type:Buffer
- -3db Bandwidth:180 MHz
- Current - Output / Channel:250 mA
- Slew Rate:2000V/µs
- Gain Bandwidth Product:-
- Current - Input Bias:5 µA
- Voltage - Input Offset:30 mV
- Voltage - Supply Span ( Min):4.5 V
- Voltage - Supply Span ( Max):36 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BUF634FKTTTE3 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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