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Texas Instruments BQ77908DBTR
IC BAT MFUNC LI-ION 4-8C 38TSSOP
Manufacturer # :BQ77908DBTR
Manufacturer :Texas Instruments
Dasenic # :BQ77908DBTR-DS
Datasheet :
BQ77908DBTR Datasheet
BQ77908DBTR DatasheetCustomer # :
Description : IC BAT MFUNC LI-ION 4-8C 38TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 12.4000 | $ 12.4 |
In Stock: 996
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.4
Total :$ 12.40
Delivery :
Payment :
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BQ77908DBTR information
Texas Instruments BQ77908DBTR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Obsolete
- Operating Temperature:-25°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:38-TFSOP (0.173", 4.40mm Width)
- Battery Chemistry:Lithium Ion/Polymer
- Number of Cells:4 ~ 8
- Interface:I²C
- Supplier Device Package:38-TSSOP
- Fault Protection:Over Current, Over Temperature, Over/Under Voltage, Short Circuit
- Function:Multi-Function Controller
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BQ77908DBTR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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