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Texas Instruments BQ4011MA-100
Manufacturer # :BQ4011MA-100
Manufacturer :Texas Instruments
Dasenic # :BQ4011MA-100-DS
Datasheet : BQ4011MA-100 Datasheet
Customer # :
Description : IC NVSRAM 256KBIT PARALLEL 28DIP
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In Stock: 13
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 28.5912
Total :$ 28.59
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BQ4011MA-100 information
Texas Instruments BQ4011MA-100 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:28-DIP Module (0.61", 15.49mm)
- Technology:NVSRAM (Non-Volatile SRAM)
- Supplier Device Package:28-DIP Module (18.42x37.72)
- Memory Size:256Kb (32K x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:4.75V ~ 5.5V
- Clock Frequency:-
- Access Time:100 ns
- Memory Format:NVSRAM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:100ns
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BQ4011MA-100 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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