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  • Texas Instruments BQ298010RUGR

    IC BATT MON LI-ION 1CELL 8X2QFN
  • part number has RoHS
  • Mfr.Part # :BQ298010RUGR
  • Manufacturer :Texas Instruments
  • Dasenic # :BQ298010RUGR-DS
  • Datasheet :pdf download BQ298010RUGR Datasheet
  • Description : IC BATT MON LI-ION 1CELL 8X2QFN
  • Package :-
  • Quantity :
    Unit Price : $ 0.522Total : $ 0.52
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 11015
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.5220$ 0.52
10 +$ 0.3438$ 3.44
100 +$ 0.2781$ 27.81
500 +$ 0.2664$ 133.20
1000 +$ 0.2214$ 221.40

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Texas Instruments BQ298010RUGR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Battery Management
Product Status:Active
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-XFQFN
Battery Chemistry:Lithium Ion/Polymer
Number of Cells:1
Interface:-
Supplier Device Package:8-X2QFN (1.5x1.5)
Fault Protection:Over Current, Over Temperature, Over/Under Voltage, Short Circuit
Function:Battery Monitor
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ298010RUGR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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