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Texas Instruments BQ296106DSGR
Manufacturer # :BQ296106DSGR
Manufacturer :Texas Instruments
Dasenic # :BQ296106DSGR-DS
Datasheet : BQ296106DSGR Datasheet
Customer # :
Description : 2-4S Overvoltage Protector with LDO Output
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In Stock: 983
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.24
Total :$ 1.24
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Payment :
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BQ296106DSGR information
Texas Instruments BQ296106DSGR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Active
- Operating Temperature:-40°C ~ 110°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-WFDFN Exposed Pad
- Functions:Battery Protection
- Battery Chemistry:Lithium Ion
- Number of Cells:2 ~ 4
- Supplier Device Package:8-WSON (2x2)
- Fault Protection:Over Voltage
- Base Product Number:BQ296106
- Packaging:Tape & Reel (TR)
- Packaging:Cut Tape (CT)
- Packaging:Dasenic-Reel®
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ296106DSGR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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