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Texas Instruments BQ25882YFFT
Manufacturer # :BQ25882YFFT
Manufacturer :Texas Instruments
Dasenic # :BQ25882YFFT-DS
Datasheet : BQ25882YFFT Datasheet
Customer # :
Description : IC BATT PWR MGMT MULT 2C 25DSBGA
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In Stock: 3567
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.9024
Total :$ 3.90
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BQ25882YFFT information
Texas Instruments BQ25882YFFT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:25-UFBGA, DSBGA
- Battery Chemistry:Multi-Chemistry
- Number of Cells:2
- Interface:I²C
- Supplier Device Package:25-DSBGA
- Fault Protection:Over Current, Over Temperature, Short Circuit
- Function:Power Management
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ25882YFFT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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