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Texas Instruments BQ24308DSGR
Manufacturer # :BQ24308DSGR
Manufacturer :Texas Instruments
Dasenic # :BQ24308DSGR-DS
Datasheet : BQ24308DSGR Datasheet
Customer # :
Description : IC BATT PROTECTION LI-ION 8WSON
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3462
Total :$ 0.35
Delivery :
Payment :
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BQ24308DSGR information
Texas Instruments BQ24308DSGR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:8-WFDFN Exposed Pad
- Battery Chemistry:Lithium Ion
- Number of Cells:-
- Interface:-
- Supplier Device Package:8-WSON (2x2)
- Fault Protection:Over Current, Over Temperature, Over/Under Voltage
- Function:Battery Protection
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BQ24308DSGR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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