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Texas Instruments BQ24261YFFT

IC BATT CHG LI-ION 1CELL 36DSBGA
part number has RoHS
Manufacturer # :BQ24261YFFT
Manufacturer :Texas Instruments
Dasenic # :BQ24261YFFT-DS
Customer # :
Description : IC BATT CHG LI-ION 1CELL 36DSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.6190$ 2.62
25+$ 2.5650$ 64.13
100+$ 2.4660$ 246.6
500+$ 2.3580$ 1179
1000+$ 2.2230$ 2223
In Stock: 8250
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.619
Total :$ 2.62
Delivery :
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BQ24261YFFT information

  • Texas Instruments BQ24261YFFT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Battery Chargers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:36-UFBGA, DSBGA
  • Battery Chemistry:Lithium Ion
  • Number of Cells:1
  • Charge Current - Max:3A
  • Interface:I²C
  • Supplier Device Package:36-DSBGA (2.63x2.46)
  • Fault Protection:Over Temperature, Over Voltage
  • Current - Charging:Constant - Programmable
  • Programmable Features:Current
  • Battery Pack Voltage:3.5V
  • Voltage - Supply ( Max):13.2V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BQ24261YFFT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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