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Texas Instruments AMC7812LSPAP
Manufacturer # :AMC7812LSPAP
Manufacturer :Texas Instruments
Dasenic # :AMC7812LSPAP-DS
Datasheet : AMC7812LSPAP Datasheet
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Description : PROTOTYPE
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In Stock: 10
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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AMC7812LSPAP information
Texas Instruments AMC7812LSPAP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C
- Mounting Type:Surface Mount
- Package / Case:64-TQFP Exposed Pad
- Type:Analog Monitor/Control Circuit
- Number of Channels:16
- Supplier Device Package:64-HTQFP (10x10)
- Voltage - Supply:2.7V ~ 5.5V, 2.7V ~ 5.5V
- Resolution ( Bits):12 b
- Sampling Rate ( Per Second):500k
- Data Interface:I²C, Serial, SPI™
- Voltage Supply Source:Analog and Digital
- Packaging:Bulk
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AMC7812LSPAP provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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