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Texas Instruments AMC6821SDBQR
Manufacturer # :AMC6821SDBQR
Manufacturer :Texas Instruments
Dasenic # :AMC6821SDBQR-DS
Datasheet : AMC6821SDBQR Datasheet
Customer # :
Description : IC TEMP MONTR/PWM FANCTRL 16SSOP 16-SSOP (0.154", 3.90mm Width)
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 48360
MOQ :1 PCS
Packaging :16-SSOP (0.154", 3.90mm Width)
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.467
Total :$ 1.47
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Payment :
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AMC6821SDBQR information
Texas Instruments AMC6821SDBQR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Thermal Management
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SSOP (0.154", 3.90mm Width)
- Output Type:SMBus
- Supplier Device Package:16-SSOP
- Voltage - Supply:2.7V ~ 5.5V
- Sensor Type:Internal and External
- Topology:ADC (Sigma Delta), Comparator, Fan Control, Multiplexer, Register Bank
- Accuracy:±3°C
- Sensing Temperature:-40°C ~ 125°C
- Output Alarm:Yes
- Output Fan:Yes
- Function:Temperature Monitor
AMC6821SDBQR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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