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Texas Instruments AMC1311DWV
IC ISOLATION 8SOIC
Manufacturer # :AMC1311DWV
Manufacturer :Texas Instruments
Dasenic # :AMC1311DWV-DS
Datasheet :
AMC1311DWV Datasheet
AMC1311DWV DatasheetCustomer # :
Description : IC ISOLATION 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 21+ | $ 2.2383 | $ 47 |
| 49+ | $ 1.8369 | $ 90.01 |
| 76+ | $ 1.7793 | $ 135.23 |
| 105+ | $ 1.7217 | $ 180.78 |
| 136+ | $ 1.6650 | $ 226.44 |
In Stock: 26670
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.2383
Total :$ 2.24
Delivery :
Payment :
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AMC1311DWV information
Texas Instruments AMC1311DWV technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Special Purpose
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.295", 7.50mm Width)
- Type:Isolation
- Supplier Device Package:8-SOIC
- Applications:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AMC1311DWV provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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