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Texas Instruments AM5706BCBDJEA
Manufacturer # :AM5706BCBDJEA
Manufacturer :Texas Instruments
Dasenic # :AM5706BCBDJEA-DS
Datasheet : AM5706BCBDJEA Datasheet
Customer # :
Description : J6ENTRY PG 2.0 17MM GP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1550
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 43.56
Total :$ 43.56
Delivery :
Payment :
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AM5706BCBDJEA information
Texas Instruments AM5706BCBDJEA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microprocessors
- Product Status:Active
- Operating Temperature:0°C ~ 90°C (TJ)
- Package / Case:538-LFBGA, FCBGA
- Supplier Device Package:538-FCBGA (17x17)
- Voltage - I/ O:1.35V, 1.5V, 1.8V, 3.3V
- Speed:667MHz
- Core Processor:ARM® Cortex®-A15
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:ARM® Cortex®-M4, C66x
- R A M Controllers:DDR3, DDR3L
- Graphics Acceleration:Yes
- Display & Interface Controllers:HDMI, Video
- Ethernet:10/100/1000Mbps (2)
- S A T A:-
- U S B:USB 2.0 (2), USB 3.0 (2)
- Security Features:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AM5706BCBDJEA provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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