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Texas Instruments AM3715CBP
Manufacturer # :AM3715CBP
Manufacturer :Texas Instruments
Dasenic # :AM3715CBP-DS
Datasheet : AM3715CBP Datasheet
Customer # :
Description : IC MPU SITARA 800MHZ 515FCBGA
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In Stock: 1472
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 64.6021
Total :$ 64.60
Delivery :
Payment :
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AM3715CBP information
Texas Instruments AM3715CBP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microprocessors
- Product Status:Not For New Designs
- Operating Temperature:0°C ~ 90°C (TJ)
- Package / Case:515-WFBGA, FCBGA
- Supplier Device Package:515-POP-FCBGA (12x12)
- Voltage - I/ O:1.8V
- Speed:800MHz
- Core Processor:ARM® Cortex®-A8
- Number of Cores/ Bus Width:1 Core, 32-Bit
- Co- Processors/ D S P:Multimedia; NEON™ SIMD
- R A M Controllers:SDRAM
- Graphics Acceleration:Yes
- Display & Interface Controllers:LCD
- Ethernet:-
- S A T A:-
- U S B:USB 2.0 (4)
- Security Features:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AM3715CBP provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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