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Texas Instruments AFE4432YCHR
Ultrasmall, ultra-low-power, high-SNR, integrated AFE for wearable optical biosensing with FIFO
Manufacturer # :AFE4432YCHR
Manufacturer :Texas Instruments
Dasenic # :AFE4432YCHR-DS
Datasheet :
AFE4432YCHR Datasheet
AFE4432YCHR DatasheetCustomer # :
Description : Ultrasmall, ultra-low-power, high-SNR, integrated AFE for wearable optical biosensing with FIFO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 4.3470 | $ 4.35 |
| 10+ | $ 3.0330 | $ 30.33 |
| 100+ | $ 2.8620 | $ 286.2 |
| 250+ | $ 2.8170 | $ 704.25 |
| 1000+ | $ 2.7720 | $ 2772 |
In Stock: 8880
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.347
Total :$ 4.35
Delivery :
Payment :
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AFE4432YCHR information
Texas Instruments AFE4432YCHR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog Front End (AFE)
- Product Status:Active
- Package / Case:25-XFBGA, DSBGA
- Numberof Channels:3
- Numberof Bits:22
- Voltage- Supply Analog:1.7V ~ 1.9V, 3V ~ 5.5V
- Voltage- Supply Digital:1.7V ~ 1.9V, 3V ~ 5.5V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AFE4432YCHR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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