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Texas Instruments ADS8505IDW
Manufacturer # :ADS8505IDW
Manufacturer :Texas Instruments
Dasenic # :ADS8505IDW-DS
Datasheet : ADS8505IDW Datasheet
Customer # :
Description : IC ADC 16BIT SAR 28SOIC
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In Stock: 7212
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.7939
Total :$ 17.79
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ADS8505IDW information
Texas Instruments ADS8505IDW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:28-SOIC (0.295", 7.50mm Width)
- Input Type:Single Ended
- Supplier Device Package:28-SOIC
- Configuration:S/H-ADC
- Sampling Rate ( Per Second):250k
- Data Interface:Parallel
- Number of Bits:16
- Voltage - Supply, Analog:5V
- Voltage - Supply, Digital:5V
- Number of Inputs:1
- Ratio - S/ H: A D C:1:1
- Number of A/ D Converters:1
- Architecture:SAR
- Reference Type:External, Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADS8505IDW provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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