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Texas Instruments ADS58J64IRMPR
Manufacturer # :ADS58J64IRMPR
Manufacturer :Texas Instruments
Dasenic # :ADS58J64IRMPR-DS
Datasheet : ADS58J64IRMPR Datasheet
Customer # :
Description : IC CAP TO DGT 14BIT 500M 72VQFN
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In Stock: 882
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1817.28
Total :$ 1817.28
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ADS58J64IRMPR information
Texas Instruments ADS58J64IRMPR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:72-VFQFN Exposed Pad
- Type:Capacitance-to-Digital Converter
- Number of Channels:4
- Supplier Device Package:72-VQFN (10x10)
- Voltage - Supply:1.1V ~ 1.2V, 1.8V ~ 2V
- Resolution ( Bits):14 b
- Sampling Rate ( Per Second):500M
- Data Interface:JESD204B
- Voltage Supply Source:Analog and Digital
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADS58J64IRMPR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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