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Texas Instruments ADS114S06BIPBS
Manufacturer # :ADS114S06BIPBS
Manufacturer :Texas Instruments
Dasenic # :ADS114S06BIPBS-DS
Datasheet : ADS114S06BIPBS Datasheet
Customer # :
Description : IC ADC 16BIT SIGMA-DELTA 32TQFP
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In Stock: 3096
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.273
Total :$ 6.27
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ADS114S06BIPBS information
Texas Instruments ADS114S06BIPBS technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Features:PGA, Temperature Sensor
- Mounting Type:Surface Mount
- Package / Case:32-TQFP
- Input Type:Differential, Pseudo-Differential, Single Ended
- Supplier Device Package:32-TQFP (5x5)
- Configuration:MUX-PGA-ADC
- Sampling Rate ( Per Second):4k
- Data Interface:SPI
- Number of Bits:16
- Voltage - Supply, Analog:±2.5V, 2.7V ~ 5.25V
- Voltage - Supply, Digital:2.7V ~ 3.6V
- Number of Inputs:4, 6
- Ratio - S/ H: A D C:-
- Number of A/ D Converters:1
- Architecture:Sigma-Delta
- Reference Type:External, Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADS114S06BIPBS provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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