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Texas Instruments ADC12DJ3200ZEGT

12-bit, dual 3.2-GSPS or single 6.4-GSPS, RF-sampling analog-to-digital converter (ADC)
part number has RoHS
Manufacturer # :ADC12DJ3200ZEGT
Manufacturer :Texas Instruments
Dasenic # :ADC12DJ3200ZEGT-DS
Customer # :
Description : 12-bit, dual 3.2-GSPS or single 6.4-GSPS, RF-sampling analog-to-digital converter (ADC)
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QuantityUnit PriceTotal
10+$ 4189.5360$ 41895.36
250+$ 3491.2800$ 872820
In Stock: 1846
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4189.536
Total :$ 4189.54
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ADC12DJ3200ZEGT information

  • Texas Instruments ADC12DJ3200ZEGT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
  • Product Status:Active
  • Features:Simultaneous Sampling
  • Package / Case:144-BGA, FCBGA
  • Supplier Device Package:144-FCBGA
  • Configuration:MUX-ADC
  • Architecture:FLASH, SAR
  • Operating Temperature:-40°C ~ 85°C
  • Data Interface:JESD204B
  • Sampling Rate( Per Second):3.2G, 6.4G
  • Numberof Bits:12
  • Voltage- Supply Analog:1.05V ~ 1.15V, 1.8V ~ 2V
  • Voltage- Supply Digital:1.05V ~ 1.15V
  • Input Type:Differential, Single Ended
  • Ratio- S/ H: A D C:0:1
  • Reference Type:Internal
  • Numberof Inputs:1, 2
  • Numberof A/ D Converters:2
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADC12DJ3200ZEGT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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