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Texas Instruments ADC12DJ2700ZEGT
12-bit, dual 2.7-GSPS or single 5.4-GSPS, RF-sampling analog-to-digital converter (ADC)
Manufacturer # :ADC12DJ2700ZEGT
Manufacturer :Texas Instruments
Dasenic # :ADC12DJ2700ZEGT-DS
Datasheet :
ADC12DJ2700ZEGT Datasheet
ADC12DJ2700ZEGT DatasheetCustomer # :
Description : 12-bit, dual 2.7-GSPS or single 5.4-GSPS, RF-sampling analog-to-digital converter (ADC)
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| Quantity | Unit Price | Total |
| 10+ | $ 3768.3936 | $ 37683.94 |
| 250+ | $ 3140.3280 | $ 785082 |
In Stock: 2277
MOQ :1 PCS
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Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 3768.3936
Total :$ 3768.39
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ADC12DJ2700ZEGT information
Texas Instruments ADC12DJ2700ZEGT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Active
- Package / Case:144-BGA, FCBGA
- Supplier Device Package:144-FCBGA
- Configuration:MUX-ADC
- Architecture:Pipelined
- Operating Temperature:-40°C ~ 85°C
- Data Interface:JESD204B, Serial
- Sampling Rate( Per Second):2.7G, 5.4G
- Numberof Bits:12
- Voltage- Supply Analog:1.05V, 1.8V ~ 1.15V, 2V
- Voltage- Supply Digital:1.05V ~ 1.15V
- Input Type:Differential
- Reference Type:Internal
- Numberof Inputs:2
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADC12DJ2700ZEGT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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