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Texas Instruments 74FCT162H501CTPACT
Manufacturer # :74FCT162H501CTPACT
Manufacturer :Texas Instruments
Dasenic # :74FCT162H501CTPACT-DS
Datasheet : 74FCT162H501CTPACT Datasheet
Customer # :
Description : IC 18BIT REGISTERED TXRX 56TSSOP
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In Stock: 9600
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.302
Total :$ 4.30
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74FCT162H501CTPACT information
Texas Instruments 74FCT162H501CTPACT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Universal Bus Functions
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package:56-TSSOP
- Number of Circuits:18-Bit
- Voltage - Supply:-
- Logic Type:Universal Bus Transceiver
- Current - Output High, Low:24mA, 24mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
74FCT162H501CTPACT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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