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Texas Instruments 74FCT16244TPVCG4

IC BUFF/DVR 16BIT N-INV 48SSOP
part number has RoHS
Manufacturer # :74FCT16244TPVCG4
Manufacturer :Texas Instruments
Dasenic # :74FCT16244TPVCG4-DS
Customer # :
Description : IC BUFF/DVR 16BIT N-INV 48SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.0710$ 1.07
25+$ 1.0530$ 26.33
100+$ 1.0080$ 100.8
500+$ 0.9630$ 481.5
1000+$ 0.9090$ 909
In Stock: 1900
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.071
Total :$ 1.07
Delivery :
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74FCT16244TPVCG4 information

  • Texas Instruments 74FCT16244TPVCG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-BSSOP (0.295", 7.50mm Width)
  • Supplier Device Package:48-SSOP
  • Number of Elements:4
  • Voltage - Supply:4.5V ~ 5.5V
  • Logic Type:Buffer, Non-Inverting
  • Number of Bits per Element:4
  • Current - Output High, Low:32mA, 64mA
  • Series:74FCT
  • Base Product Number:74FCT16244
  • Packaging:Tube
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
74FCT16244TPVCG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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