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Rohm Semiconductor UCR006YVPFLR300
Manufacturer # :UCR006YVPFLR300
Manufacturer :Rohm Semiconductor
Dasenic # :UCR006YVPFLR300-DS
Datasheet : UCR006YVPFLR300 Datasheet
Customer # :
Description : RES 0.3 OHM 1% 1/10W 0201
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In Stock: 24803
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.129
Total :$ 0.13
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UCR006YVPFLR300 information
Rohm Semiconductor UCR006YVPFLR300 technical specifications, attributes, parameters.
- Category:Resistors/Chip Resistors & Surface Mount Resistors
- Product Status:Active
- Tolerance:±1%
- Temperature Coefficient:0/ +300ppm/°C
- Operating Temperature:-55°C ~ 155°C
- Features:Current Sense
- Ratings:-
- Failure Rate:-
- Package / Case:0201 (0603 Metric)
- Size / Dimension:0.024" L x 0.013" W (0.60mm x 0.33mm)
- Height - Seated ( Max):0.011" (0.28mm)
- Supplier Device Package:0201
- Power ( Watts):0.1W, 1/10W
- Number of Terminations:2
- Resistance:300 mOhms
- Composition:Thick Film
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UCR006YVPFLR300 provided by ROHM Semiconductor
ROHM Semiconductor(TYO:6963)is one of the world's leading semiconductor and electronic component manufacturers. Founded in 1958, it is a multinational group company headquartered in Kyoto, Japan.
ROHM has expanded its business domain by building up its design and manufacturing technologies, quality assurance technologies, and solution proposal capabilities for more than 60 years since its establishment. These technologies and capabilities accumulated over its long history carry four main features: integral technologies, IDM (vertical integration as an integrated device manufacturer), a wide range of products, and customer orientation. Our focus on power and analog technology solutions where we can maximally leverage these strengths, we will provide high added value to our customers and contribute to solving social issues.
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