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Texas Instruments TLC5948APWP
Manufacturer # :TLC5948APWP
Manufacturer :Texas Instruments
Dasenic # :TLC5948APWP-DS
Datasheet : TLC5948APWP Datasheet
Customer # :
Description : IC LED DRIVER LIN 60MA 24HTSSOP
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In Stock: 10998
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.1782
Total :$ 1.18
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TLC5948APWP information
Texas Instruments TLC5948APWP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - LED Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:24-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Frequency:-
- Type:Linear
- Supplier Device Package:24-HTSSOP
- Internal Switch(s):Yes
- Voltage - Output:10V
- Current - Output / Channel:60mA
- Number of Outputs:16
- Topology:Shift Register
- Voltage - Supply ( Max):5.5V
- Voltage - Supply ( Min):3V
- Dimming:-
- Applications:Signage
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLC5948APWP provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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