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1 : $0.2970
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Texas Instruments SN74LS26N
IC GATE NAND OPEN 4CH 2-IN 14DIP
Manufacturer # :SN74LS26N
Manufacturer :Texas Instruments
Dasenic # :SN74LS26N-DS
Datasheet :
SN74LS26N Datasheet
SN74LS26N DatasheetCustomer # :
Description : IC GATE NAND OPEN 4CH 2-IN 14DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.2970 | $ 0.3 |
In Stock: 10140
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.297
Total :$ 0.30
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SN74LS26N information
Texas Instruments SN74LS26N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Gates and Inverters
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Features:Open Collector
- Mounting Type:Through Hole
- Package / Case:14-DIP (0.300", 7.62mm)
- Supplier Device Package:14-PDIP
- Number of Circuits:4
- Voltage - Supply:4.75V ~ 5.25V
- Number of Inputs:2
- Current - Quiescent ( Max):-
- Logic Type:NAND Gate
- Current - Output High, Low:-, 8mA
- Max Propagation Delay @ V, Max C L:32ns @ 5V, 15pF
- Logic Level - Low:0.8V
- Logic Level - High:2V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74LS26N provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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