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Rochester Electronics SN74ALS232BN

IC FIFO ASYNC 4X16 16DIP
part number has RoHS
Manufacturer # :SN74ALS232BN
Manufacturer :Rochester Electronics
Dasenic # :SN74ALS232BN-DS
Customer # :
Description : IC FIFO ASYNC 4X16 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 9.6480$ 9.65
25+$ 9.4590$ 236.48
100+$ 9.0720$ 907.2
500+$ 8.6850$ 4342.5
1000+$ 8.1990$ 8199
In Stock: 12632
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.648
Total :$ 9.65
Delivery :
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Payment :
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SN74ALS232BN information

  • Rochester Electronics SN74ALS232BN technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:16-DIP (0.300", 7.62mm)
  • Supplier Device Package:16-PDIP
  • Memory Size:64 (16 x 4)
  • Voltage - Supply:4.5 V ~ 5.5 V
  • Current - Supply ( Max):125mA
  • Data Rate:40MHz
  • Access Time:30ns
  • Bus Directional:Uni-Directional
  • Expansion Type:Width
  • Programmable Flags Support:No
  • Retransmit Capability:No
  • F W F T Support:No
  • Function:Asynchronous
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74ALS232BN provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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