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Rochester Electronics SAK-XC2361A56F80LAAKXUMA1
Manufacturer # :SAK-XC2361A56F80LAAKXUMA1
Manufacturer :Rochester Electronics
Dasenic # :SAK-XC2361A56F80LAAKXUMA1-DS
Datasheet : SAK-XC2361A56F80LAAKXUMA1 Datasheet
Customer # :
Description : 16-BIT C166 MCU - XC2300 FAMILY
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
Payment :
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SAK-XC2361A56F80LAAKXUMA1 information
Rochester Electronics SAK-XC2361A56F80LAAKXUMA1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-LQFP Exposed Pad
- Supplier Device Package:PG-LQFP-100-8
- Peripherals:I²S, POR, PWM, WDT
- Number of I/ O:75
- Speed:80MHz
- E E P R O M Size:-
- Core Processor:C166SV2
- R A M Size:50K x 8
- Program Memory Type:Flash
- Core Size:16/32-Bit
- Connectivity:CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
- Program Memory Size:448KB (448K x 8)
- Voltage - Supply ( Vcc/ Vdd):3V ~ 5.5V
- Data Converters:A/D 16x10b
- Oscillator Type:Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SAK-XC2361A56F80LAAKXUMA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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