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Onsemi RMPA1765

IC AMP CDMA 1.72GHZ-1.78GHZ 8LCC
part number has RoHS
Manufacturer # :RMPA1765
Manufacturer :Onsemi
Dasenic # :RMPA1765-DS
Customer # :
Description : IC AMP CDMA 1.72GHZ-1.78GHZ 8LCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.5655$ 0.57
25+$ 0.5541$ 13.85
100+$ 0.5315$ 53.15
500+$ 0.5090$ 254.5
1000+$ 0.4807$ 480.7
In Stock: 36339
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5655
Total :$ 0.57
Delivery :
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RMPA1765 information

  • Onsemi RMPA1765 technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Amplifiers
  • Product Status:Obsolete
  • Mounting Type:Surface Mount
  • Package / Case:8-TDFN Exposed Pad
  • Frequency:1.72GHz ~ 1.78GHz
  • Current - Supply:45mA
  • Supplier Device Package:8-LCC (3x3)
  • Voltage - Supply:3V ~ 4.2V
  • Gain:26dB
  • Noise Figure:4dB
  • P1d B:-
  • R F Type:CDMA, CDMA2000, AMPS, K-PCS
  • Test Frequency:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
RMPA1765 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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