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1 : $57.3750

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Rochester Electronics QS723621-25TF

QUALITY SEMI BI-DIR FIFO 2KX36
part number has RoHS
Manufacturer # :QS723621-25TF
Manufacturer :Rochester Electronics
Dasenic # :QS723621-25TF-DS
Customer # :
Description : QUALITY SEMI BI-DIR FIFO 2KX36
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 57.3750$ 57.38
25+$ 56.2320$ 1405.8
100+$ 53.9370$ 5393.7
500+$ 51.6420$ 25821
1000+$ 48.7710$ 48771
In Stock: 1948
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 57.375
Total :$ 57.38
Delivery :
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Payment :
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QS723621-25TF information

  • Rochester Electronics QS723621-25TF technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:144-QFP
  • Supplier Device Package:-
  • Memory Size:72K (2K x 36)
  • Voltage - Supply:-
  • Current - Supply ( Max):-
  • Data Rate:-
  • Access Time:25ns
  • Bus Directional:-
  • Expansion Type:-
  • Programmable Flags Support:Yes
  • Retransmit Capability:-
  • F W F T Support:No
  • Function:Synchronous
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
QS723621-25TF provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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