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Texas Instruments PCM2706CPJT
Manufacturer # :PCM2706CPJT
Manufacturer :Texas Instruments
Dasenic # :PCM2706CPJT-DS
Datasheet : PCM2706CPJT Datasheet
Customer # :
Description : IC AUDIO SIGNAL PROCESSOR 32TQFP
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In Stock: 4500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.1437
Total :$ 3.14
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Payment :
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PCM2706CPJT information
Texas Instruments PCM2706CPJT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:32-TQFP
- Number of Channels:2
- Interface:I²C, SPI
- Specifications:-
- Supplier Device Package:32-TQFP (7x7)
- Voltage - Supply:3V ~ 3.6V
- Applications:Audio Systems
- Function:Audio Signal Processor
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PCM2706CPJT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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