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Texas Instruments LM360M
IC COMPARATOR HS DIFF 8-SOIC
Manufacturer # :LM360M
Manufacturer :Texas Instruments
Dasenic # :LM360M-DS
Datasheet :
LM360M Datasheet
LM360M DatasheetCustomer # :
Description : IC COMPARATOR HS DIFF 8-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 190+ | $ 9.9529 | $ 1891.05 |
In Stock: 1161
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.9529
Total :$ 9.95
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LM360M information
Texas Instruments LM360M technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Comparators
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Type:Differential
- Output Type:Complementary, TTL
- Supplier Device Package:8-SOIC
- Number of Elements:1
- Voltage - Supply, Single/ Dual (±):±4.5V ~ 6.5V
- Voltage - Input Offset ( Max):5mV
- Current - Input Bias ( Max):20µA
- Current - Output ( Typ):20mA
- Current - Quiescent ( Max):32mA
- C M R R, P S R R ( Typ):-
- Propagation Delay ( Max):130ns
- Hysteresis:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LM360M provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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