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Texas Instruments LM13700M/NOPB

IC OPAMP TRANSCOND 2 CIRC 16SOIC
part number has RoHS
Manufacturer # :LM13700M/NOPB
Manufacturer :Texas Instruments
Dasenic # :LM13700M/NOPB-DS
Customer # :
Description : IC OPAMP TRANSCOND 2 CIRC 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
135+$ 0.3339$ 45.08
290+$ 0.3123$ 90.57
450+$ 0.3015$ 135.68
645+$ 0.2799$ 180.54
840+$ 0.2691$ 226.04
In Stock: 59136
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3339
Total :$ 0.33
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LM13700M/NOPB information

  • Texas Instruments LM13700M/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Package / Case:16-SOIC (0.154", 3.90mm Width)
  • Current - Supply:2.6mA (x2 Channels)
  • Output Type:Push-Pull
  • Supplier Device Package:16-SOIC
  • Number of Circuits:2
  • Amplifier Type:Transconductance
  • Current - Output / Channel:500 µA
  • Slew Rate:50V/µs
  • Gain Bandwidth Product:2 MHz
  • Current - Input Bias:400 nA
  • Voltage - Input Offset:300 µV
  • Voltage - Supply Span ( Min):10 V
  • Voltage - Supply Span ( Max):36 V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LM13700M/NOPB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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