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Onsemi FSA3000L10X-F131
Manufacturer # :FSA3000L10X-F131
Manufacturer :Onsemi
Dasenic # :FSA3000L10X-F131-DS
Datasheet : FSA3000L10X-F131 Datasheet
Customer # :
Description : IC ANLG VIDEO SWITCH 10-MICROPAK
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In Stock: 10972
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4459
Total :$ 0.45
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FSA3000L10X-F131 information
Onsemi FSA3000L10X-F131 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches - Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Break-Before-Make, USB 2.0
- Mounting Type:Surface Mount
- Package / Case:10-UFQFN Exposed Pad
- Number of Channels:-
- Supplier Device Package:10-MicroPak™
- Multiplexer/ Demultiplexer Circuit:-
- Switch Circuit:DPDT
- On- State Resistance ( Max):4.8Ohm (USB), 6Ohm (MHL)
- Voltage - Supply, Single ( V+):2.7V ~ 4.3V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:2.46GHz
- Applications:USB
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FSA3000L10X-F131 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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