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Onsemi FMG1G100US60H

Name: FMG1G100US60H
Brand: Onsemi
SKU: FMG1G100US60H-DS
Price: 42.0863 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 1560

MOQ: 1

1 Price Tiers

Mfr.Part # :FMG1G100US60H
Manufacturer :Onsemi
Dasenic # :FMG1G100US60H-DS
Datasheet : FMG1G100US60H Datasheet PDF
Description : IGBT MODULE 600V 100A 400W 7PMGA
Package :-
Unit Price: $42.0863
Total: $42.09

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1-25	$42.0863	-

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Onsemi FMG1G100US60H technical specifications, attributes, parameters.

Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules

Product Status:Obsolete

Operating Temperature:-40°C ~ 150°C (TJ)

Mounting Type:Chassis Mount

Package / Case:7PM-GA

Power - Max:400 W

Supplier Device Package:7PM-GA

Configuration:Single

Input:Standard

Current - Collector ( Ic) ( Max):100 A

Voltage - Collector Emitter Breakdown ( Max):600 V

Current - Collector Cutoff ( Max):250 µA

I G B T Type:-

Vce(on) ( Max) @ Vge, Ic:2.8V @ 15V, 100A

Input Capacitance ( Cies) @ Vce:10.84 nF @ 30 V

N T C Thermistor:No

EU RoHS Status:ROHS3 Compliant

US ECCN:EAR99

HTS US:8541.29.0095

REACH Status:Vendor is not defined

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

FMG1G100US60H provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.