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Onsemi FIN210ACGFX
Manufacturer # :FIN210ACGFX
Manufacturer :Onsemi
Dasenic # :FIN210ACGFX-DS
Datasheet : FIN210ACGFX Datasheet
Customer # :
Description : IC SER/DES 10BIT 42-USSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6946
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.179
Total :$ 1.18
Delivery :
Payment :
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FIN210ACGFX information
Onsemi FIN210ACGFX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Serializers, Deserializers
- Product Status:Obsolete
- Operating Temperature:-30°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:42-VFBGA
- Input Type:LVCMOS
- Output Type:LVCMOS
- Supplier Device Package:42-USS-BGA (3.5x4.5)
- Voltage - Supply:1.65V ~ 3.6V
- Number of Inputs:10/2
- Data Rate:-
- Number of Outputs:2/10
- Function:Serializer/Deserializer
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FIN210ACGFX provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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