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Onsemi FFD08S60S-F085
Manufacturer # :FFD08S60S-F085
Manufacturer :Onsemi
Dasenic # :FFD08S60S-F085-DS
Datasheet : FFD08S60S-F085 Datasheet
Customer # :
Description : DIODE GEN PURP 600V 8A TO252
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In Stock: 4398
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.972
Total :$ 0.97
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FFD08S60S-F085 information
Onsemi FFD08S60S-F085 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
- Supplier Device Package:TO-252AA
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Diode Type:Standard
- Current - Average Rectified ( Io):8A
- Voltage - Forward ( Vf) ( Max) @ If:2.6 V @ 8 A
- Current - Reverse Leakage @ Vr:100 µA @ 600 V
- Capacitance @ Vr, F:-
- Voltage - D C Reverse ( Vr) ( Max):600 V
- Reverse Recovery Time (trr):30 ns
- Operating Temperature - Junction:-65°C ~ 150°C
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FFD08S60S-F085 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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