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  • Onsemi FAN5702UMP30X

    IC LED DRIVER RGLTR DIM 16UMLP
  • part number has RoHS
  • Mfr.Part # :FAN5702UMP30X
  • Manufacturer :Onsemi
  • Dasenic # :FAN5702UMP30X-DS
  • Datasheet :pdf download FAN5702UMP30X Datasheet
  • Description : IC LED DRIVER RGLTR DIM 16UMLP
  • Package :-
  • Quantity :
    Unit Price : $ 2.58Total : $ 2.58
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 2915
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 2.5800$ 2.58

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Onsemi FAN5702UMP30X technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/LED Drivers
Product Status:Active
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:16-UFQFN Exposed Pad
Frequency:1.2MHz
Type:DC DC Regulator
Supplier Device Package:16-UMLP (3x3)
Internal Switch(s):Yes
Voltage - Output:-
Current - Output / Channel:30mA
Number of Outputs:6
Topology:Switched Capacitor (Charge Pump)
Voltage - Supply ( Max):5.5V
Voltage - Supply ( Min):2.7V
Dimming:I²C, PWM
Applications:Backlight
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
FAN5702UMP30X provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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