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Texas Instruments DP83816AVNG-EX/NOPB
Manufacturer # :DP83816AVNG-EX/NOPB
Manufacturer :Texas Instruments
Dasenic # :DP83816AVNG-EX/NOPB-DS
Datasheet : DP83816AVNG-EX/NOPB Datasheet
Customer # :
Description : IC MACPHY 10/100 802.3 144LQFP
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In Stock: 52151
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.9
Total :$ 0.90
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DP83816AVNG-EX/NOPB information
Texas Instruments DP83816AVNG-EX/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Controllers
- Product Status:Not For New Designs
- Operating Temperature:0°C ~ 85°C
- Package / Case:144-LQFP
- Current - Supply:116mA
- Interface:PCI
- Supplier Device Package:144-LQFP (20x20)
- Standards:IEEE 802.3, 10/100 Base-T/TX PHY
- Voltage - Supply:3V ~ 3.6V
- Protocol:Ethernet
- Function:Controller
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DP83816AVNG-EX/NOPB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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