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Onsemi DM74S283N

IC ADDER BIN W/CARRY 4BIT 16-DIP
part number has RoHS
Manufacturer # :DM74S283N
Manufacturer :Onsemi
Dasenic # :DM74S283N-DS
Customer # :
Description : IC ADDER BIN W/CARRY 4BIT 16-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.7117$ 0.71
25+$ 0.6975$ 17.44
100+$ 0.6691$ 66.91
500+$ 0.6405$ 320.25
1000+$ 0.6050$ 605
In Stock: 5784
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7117
Total :$ 0.71
Delivery :
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Payment :
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DM74S283N information

  • Onsemi DM74S283N technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Specialty Logic
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:16-DIP (0.300", 7.62mm)
  • Supplier Device Package:16-PDIP
  • Supply Voltage:4.75V ~ 5.25V
  • Number of Bits:4
  • Logic Type:Binary Full Adder with Fast Carry
  • EU RoHS Status:RoHS non-compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DM74S283N provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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