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Texas Instruments CP3BT13G38
Manufacturer # :CP3BT13G38
Manufacturer :Texas Instruments
Dasenic # :CP3BT13G38-DS
Datasheet : CP3BT13G38 Datasheet
Customer # :
Description : IC CPU RISC W/LLC&CAN 100-LQFP
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In Stock: 4494
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.427
Total :$ 5.43
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CP3BT13G38 information
Texas Instruments CP3BT13G38 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:100-LQFP
- Interface:Bluetooth, ACCESS.bus, Audio, CAN, Microwire/SPI, UART
- Supplier Device Package:100-QFP (14x14)
- Voltage - Supply:2.25V ~ 2.75V
- Number of I/ O:40
- Core Processor:CR16C
- R A M Size:10K x 8
- Program Memory Type:FLASH (256kB)
- Controller Series:CP3000
- Applications:Connectivity Processor
- EU RoHS Status:RoHS non-compliant
- US ECCN:5A002A1
- HTS US:8542.31.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CP3BT13G38 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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