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Texas Instruments CD74HC40105M

Name: CD74HC40105M
Brand: Texas Instruments
SKU: CD74HC40105M-DS
Price: 0.9487 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 14000

MOQ: 1

2 Price Tiers

Mfr.Part # :CD74HC40105M
Manufacturer :Texas Instruments
Dasenic # :CD74HC40105M-DS
Datasheet : CD74HC40105M Datasheet PDF
Description : IC FIFO REGISTER 16-SOIC
Package :-
Unit Price: $0.9487
Total: $0.95

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Texas Instruments CD74HC40105M technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/FIFOs Memory

Product Status:Active

Operating Temperature:-55°C ~ 125°C

Mounting Type:Surface Mount

Package / Case:16-SOIC (0.154", 3.90mm Width)

Supplier Device Package:16-SOIC

Memory Size:64 (16 x 4)

Voltage - Supply:2 V ~ 6 V

Current - Supply ( Max):-

Data Rate:-

Access Time:-

Bus Directional:Uni-Directional

Expansion Type:Depth, Width

Programmable Flags Support:No

Retransmit Capability:No

F W F T Support:No

Function:Asynchronous

EU RoHS Status:RoHS non-compliant

US ECCN:EAR99

HTS US:8542.39.0001

REACH Status:Vendor is not defined

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

CD74HC40105M provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.