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1 : $5.1407
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IDT, Integrated Device Technology Inc ZSSC4151CE1D
DICE (WAFER SAWN) - WAFFLE PACK
Manufacturer # :ZSSC4151CE1D
Manufacturer :IDT, Integrated Device Technology Inc
Dasenic # :ZSSC4151CE1D-DS
Datasheet :
ZSSC4151CE1D Datasheet
ZSSC4151CE1D DatasheetCustomer # :
Description : DICE (WAFER SAWN) - WAFFLE PACK
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 200+ | $ 5.1407 | $ 1028.14 |
In Stock: 1865
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.1407
Total :$ 5.14
Delivery :
Payment :
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ZSSC4151CE1D information
IDT, Integrated Device Technology Inc ZSSC4151CE1D technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Sensor and Detector Interfaces
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TA)
- Mounting Type:Surface Mount
- Package / Case:Die
- Input Type:Analog
- Current - Supply:7 mA
- Type:Signal Conditioner
- Output Type:1-Wire®, I²C
- Supplier Device Package:Die
- Series:Automotive, AEC-Q100
- Packaging:Tray
- EU RoHS Status:ROHS3 Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ZSSC4151CE1D provided by IDT, Integrated Device Technology Inc
Renesas Electronics Corporation (TSE: 6723) is the world's premier supplier of microcontrollers and a preferred provider of advanced semiconductor solutions.
Renesas Electronics was established in November 2002 through the merger of two major Japanese semiconductor companies: Hitachi Semiconductor and Mitsubishi Electric. As a global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of applications, including automotive, industrial, home electronics, office automation, and information communication technology.
The company's global headquarters are located in Tokyo.Renesas Electronics has a significant global footprint, with offices, research and development centers, manufacturing facilities, and sales operations in Europe, the Middle East, Asia, and North America.
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