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IDT, Integrated Device Technology Inc RV1S9209ACCSP-10YC#KC0
Manufacturer # :RV1S9209ACCSP-10YC#KC0
Manufacturer :IDT, Integrated Device Technology Inc
Dasenic # :RV1S9209ACCSP-10YC#KC0-DS
Datasheet : RV1S9209ACCSP-10YC#KC0 Datasheet
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Description : OPT2 CPLR HS LSSO5 5M NIPDAU
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In Stock: 51601
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7702
Total :$ 0.77
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RV1S9209ACCSP-10YC#KC0 information
IDT, Integrated Device Technology Inc RV1S9209ACCSP-10YC#KC0 technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Logic Output
- Product Status:Active
- Package / Case:5-SMD, Gull Wing
- Operating Temperature:-40°C ~ 125°C
- Voltage- Isolation:5000Vrms
- Voltage- Supply:4.5V ~ 20V
- Numberof Channels:1
- Input Type:DC
- Output Type:Push-Pull, Totem Pole
- Current- Output/ Channel:25 mA
- Rise/ Fall Time( Typ):25ns, 5ns
- Inputs- Side1/ Side2:1/0
- Propagation Delaytp L H/tp H L( Max):200ns, 200ns
- Common Mode Transient Immunity( Min):50kV/µs
- Voltage- Forward( Vf)( Typ):1.56V
- Current- D C Forward( If)( Max):20mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
RV1S9209ACCSP-10YC#KC0 provided by IDT, Integrated Device Technology Inc
Renesas Electronics Corporation (TSE: 6723) is the world's premier supplier of microcontrollers and a preferred provider of advanced semiconductor solutions.
Renesas Electronics was established in November 2002 through the merger of two major Japanese semiconductor companies: Hitachi Semiconductor and Mitsubishi Electric. As a global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of applications, including automotive, industrial, home electronics, office automation, and information communication technology.
The company's global headquarters are located in Tokyo.Renesas Electronics has a significant global footprint, with offices, research and development centers, manufacturing facilities, and sales operations in Europe, the Middle East, Asia, and North America.
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