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IDT, Integrated Device Technology Inc ISL5585FCMZ-T

IC SLIC RINGING 3.3V VOB 28-PLCC
part number has RoHS
Manufacturer # :ISL5585FCMZ-T
Dasenic # :ISL5585FCMZ-T-DS
Customer # :
Description : IC SLIC RINGING 3.3V VOB 28-PLCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 10
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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ISL5585FCMZ-T information

  • IDT, Integrated Device Technology Inc ISL5585FCMZ-T technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Telecom
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:28-LCC (J-Lead)
  • Functions:Subscriber Line Interface Concept (SLIC)
  • Supplier Device Package:28-PLCC (11.51x11.51)
  • Number of Circuits:1
  • Power ( Watts):305 mW
  • Voltage - Supply:3.3V
  • Base Product Number:ISL5585
  • Packaging:Tape & Reel (TR)
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ISL5585FCMZ-T provided by IDT, Integrated Device Technology Inc
Renesas Electronics Corporation (TSE: 6723) is the world's premier supplier of microcontrollers and a preferred provider of advanced semiconductor solutions. Renesas Electronics was established in November 2002 through the merger of two major Japanese semiconductor companies: Hitachi Semiconductor and Mitsubishi Electric. As a global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of applications, including automotive, industrial, home electronics, office automation, and information communication technology. The company's global headquarters are located in Tokyo.Renesas Electronics has a significant global footprint, with offices, research and development centers, manufacturing facilities, and sales operations in Europe, the Middle East, Asia, and North America.
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